Hoch XPS 300 (LAP) 30 mm - insulation board
- Boards per package: 12 boards
- Pallet dimensions (length x width x height): 125x120
- Packages per pallet: 14 packs
- Full specification
HOCH XPS (eXtruded PolyStyrene foam) insulation boards, formed during polystyrene extrusion, offer high mechanical strength, water resistance, and excellent thermal insulation. Their homogeneous and cellular structure ensures versatility in construction with features like high compressive strength, easy installation, and varied thicknesses. Additionally, enhanced antifungal and biocidal properties provide above-average microbiological resistance, making them ideal for protecting construction objects from bacteria and fungi caused by moisture, faulty construction, or the environment.
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Pallet price: 251.10 € excl. VAT
This product is available in the following variants:
Thickness:
HOCH XPS 300
XPS (eXtruded PolyStyrene foam) boards feature very good thermal insulation properties. Combined with excellent insulation, low absorption (closed-cell structure) and high compressive strength, this product is very often used for thermal insulation in construction.
HOCH XPS boards have been manufactured in accordance with EN 13164:2012 + A1:2015 standard. This product does not contain flame retardants.
Main advantages of Hoch XPS boards:
- Very low heat conduction coefficient
- Closed-cell structure, which gives very low absorbability
- High compression strength
- Ease of assembly
- Full recycling (no waste)
- Cellular structure, filled with air, maintains stable thermal insulation parameters over time
- Polish product
Technical specification
Transport and storage
It is not permitted to transport XPS boards with other materials that may adversely affect mechanical or physico-chemical properties, such as solvents, paints, fuels or other hazardous materials that may move around in the load compartment. It is mandatory to prohibit smoking and usage of open fire in the load compartment where the XPS boards are located.
Extruded polystyrene boards are recommended to be stored in ventilated areas. Do not store XPS boards in one room with flammable or volatile products. This product is degraded under the influence of UV radiation. Contact with open fire must be absolutely avoided.
Assembly
Solvent-based adhesives in contact with XPS HOCH boards cause undesired effects; eventually, XPS boards are destroyed. Before assembly, check that the adhesive may be used for polystyrene foam. When mounting boards which are exposed to UV radiation, it is recommended to cover them. If you cement the boards, the surface should be rough in order to bind the board to the adhesive better. Application of the product at low temperatures requires that there is sufficient space between boards to maintain proper expansion joint.
Dimensions | 126.5 x 61.5 x 3 cm |
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Technical specifications
Manufacturer | Hoch |
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Boards per package | 12 boards |
Pallet dimensions (length x width x height) | 125x120 |
Packages per pallet | 14 packs |
Boards per pallet | 168 boards |
Max. pallets per truckload | 24 |